What is electroplating?

- Mar 14, 2018-

Electroplating is the process of electroplating a thin layer of other metal or alloy on the surface of certain metals by electrolysis. It is a process of using electrolysis to attach a metal film to the surface of metal or other materials to prevent metal oxidation ( Such as rust), improve wear resistance, conductivity, reflective, anti-corrosion (copper sulfate, etc.) and enhance the appearance and other effects. The outer layer of many coins is also electroplated.

During electroplating, a plated metal or other insoluble material is used as an anode, and a workpiece to be plated is used as a cathode. The cation of the plated metal is reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, it is necessary to use a solution containing a plating metal cation as a plating solution in order to maintain the concentration of the plating metal cation unchanged. The purpose of electroplating is to plate a metal coating on the substrate to change the nature or size of the substrate surface. Electroplating enhances the corrosion resistance of metals (more corrosion-resistant metals are used for plating metals), increases hardness, prevents abrasion, improves electrical conductivity, smoothness, heat resistance, and aesthetic appearance.

Electroplated material requirements:

Most of the plating is a single metal or alloy, such as titanium, palladium, zinc, cadmium, gold or brass, bronze, etc.; also has a dispersion layer, such as nickel-silicon carbide, nickel-fluorinated graphite, etc.; and cladding layer, such as steel The copper-nickel-chromium layer, the silver-indium layer on the steel, and the like. The electroplating base material includes iron-based cast iron, steel, and stainless steel, non-ferrous metals, or ABS plastics, polypropylene, polysulfone, and phenolic plastics, but the plastic must undergo special activation and sensitization before electroplating.